DS Smith, IBM Collaborates to Enhance Recycled Paper Quality

SEATTLE (Scrap Monster): London-headquartered global packaging leader DS Smith announced that it has collaborated with IBM in the UK to use artificial intelligence (AI) techniques to improve the quality of paper and cardboard collection for recycling. As part of this, the company has already invested in new camera technology that uses AI modelling capabilities on IBM Cloud, to assess the materials arriving at the DS Smith Kemsley recycling depot.

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The cameras, positioned in the ceiling of the depot, could identify whether the composition of the loose paper and cardboard meets strict quality guidelines before they are sent for baling and recycling. This enhances the efficiency and accuracy of the process. It must be noted that the process has until now been carried out manually.

The AI model produces imagery, which are used not only to inform the production process, but also reported back to suppliers, so as to ensure improved quality of material arriving at the depot.

Stephanie Dalton, Innovation Manager, Recycling Division at DS Smith noted that the collaboration with IBM allows the company to work even more closely with its suppliers and ultimately improve recycling by reducing recycling contamination.